| Material Code(as per DIN EN) | Cu-ETP | CU-HCP | Cu-DHP | Cu-OF |
| Material Number (as per DIN EN) | CW004A | CW021A | CW024A | CW008A |
| Material Code(as per DIN) | E-Cu58 bzw. E-Cu57 | SE-Cu | SF-Cu | OF-Cu |
| Material Number (as per DIN EN) | 2.0065/2.0060 | 2.0070 | 2.0090 | 2.0040 |
| Type in stock |       |
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| Properties | Oxygenated (touch-pitch) copper manufactured by electrolytic refining: Highly conductive for heat and electricity, excellent working properties | High purity and deoxidized copper with low residual phosphorus content. Highly conductive for heat and electricity, excellent cold and hot working properties, good corrosion resistance, good welding and hard soldering properties, good hydrogen resistance | Deoxidized oxygen-free copper with limited, high residual phosphorus content: Excellent working properties, excellent welding and hard soldering properties, excellent hydrogen resistance | Oxygen-free, manufactured without use of deoxidizing agents. High electrical conductivity. Can be heat treated, welded or hard soldered without special provisions. No measures required to prevent hydrogen embrittlement |
| Use |
Components of electrotechnology and electronics, as material for eroding and electrodes |
Components of electrotechnology and electronics (cable ties, welded cables), as cladding material) |
Piping (in particular in gas and water installation, in heating and air conditioning technology as well as plant engineering) roof and wall coverings (civil engineering), apparatus engineering, general usage where electrical conductivity is not a top priority |
Electrotechnology |
| Dichte (g/cm³) ca. |
8,93 | 8,90 | 8,94 | 8,90 |
| Information des Dt. Kupferinstituts | Cu-ETP | Cu-DHP |